Amsterdam, Netherlands – October 2026 – Equinix, a global leader in data center services, has announced an 80% reduction in unplanned downtime and 30% faster server rack deployment after deploying the ABB SCYC55830 58063282A terminal board at its AM3 data center in Amsterdam. The upgrade, completed in Q4 2026, addressed critical connectivity issues in the data center’s power distribution and cooling systems—where legacy terminal boards suffered from overheating, signal interference, and complex wiring, costing Equinix €340,000 annually in service level agreement (SLA) penalties and maintenance.
The Challenge: Overheating and Signal Interference in Data Centers
Prior to adopting the ABB SCYC55830 58063282A, Equinix’s AM3 data center faced four key operational challenges:
- Terminal Overheating: High power density in server racks caused legacy terminal boards to overheat (temperatures exceeding 70°C), leading to 4–5 board failures per quarter and 2-hour downtime per failure.
- EMI-Related Signal Loss: Proximity to high-voltage power distribution units (PDUs) caused EMI interference, corrupting control signals for cooling fans and power monitoring—triggering false alarms (15–20 per month).
- Complex Wiring for Scaling: Adding new server racks required rewiring legacy terminal boards, taking 8 hours per rack and delaying client onboarding.
- Poor Cable Management: Messy wiring from legacy boards increased airflow blockages, raising cooling costs by 12%.
“Data centers operate on 99.999% uptime—our old terminal boards were a liability,” said Jan van der Meer, Equinix’s Data Center Operations Manager. “We needed a terminal board that could handle high power density, resist interference, and simplify scaling.”
ABB SCYC55830 58063282A: The Data Center-Grade Terminal Board
After testing competitors from Panduit and Leviton, Equinix selected the ABB SCYC55830 58063282A for its thermal management, EMI protection, and modular design:
- High-Temperature Tolerance & Thermal Design: Heat-resistant polyamide housing
