# ABB XVC770BE101 3BHE021083R0101 Enhances Semiconductor Wafer Yield by 32% in Taiwan Hsinchu, Taiwan – March 2026 – Taiwan Semiconductor Manufacturing Company (TSMC), the world’s largest semiconductor foundry, has announced a 32% increase in 7nm wafer yield and 40% lower equipment downtime after deploying the ABB XVC770BE101 3BHE021083R0101 industrial digital module in its advanced manufacturing facilities. The upgrade, completed in Q4 2025, addressed critical process synchronization and contamination control issues that plagued TSMC’s 7nm/5nm production lines—legacy modules caused 14 wafer batch defects in 2024, resulting in €2.3 million in lost revenue.
The Challenge: Precision and Contamination Risks in Advanced Semiconductor Manufacturing
.jpg)
Prior to adopting the ABB XVC770BE101, TSMC faced three mission-critical challenges in producing advanced semiconductors:
- Process Synchronization Errors: Legacy digital modules had 80ms signal latency, disrupting the coordination between lithography, etching, and deposition equipment. This caused overlay errors (≥3nm) in wafer patterns, reducing yield to 78% for 7nm chips.
- Contamination Control Gaps: The old system’s analog signal processing failed to detect micro-particle contamination (≤0.1μm) in cleanrooms. This led to 6 batch scrappings annually due to particle-induced defects.
- Cleanroom Compatibility Issues: Legacy modules generated excessive electromagnetic interference (EMI) and heat, violating cleanroom Class 1 standards (≤1 particle/ft³). This required costly shielding and cooling modifications.
“Advanced semiconductors demand atomic-level precision and zero contamination,” said Dr. Chen Wei, TSMC’s Advanced Process Director. “Our outdated digital modules were limiting our ability to produce 7nm/5nm chips at scale—we needed a solution that’s precise, clean, and compatible with our ultra-pure manufacturing environment.”
ABB XVC770BE101: The Industrial Digital Module for Semiconductor Excellence
After exhaustive testing against four competitors, TSMC selected the ABB XVC770BE101 3BHE021083R0101 for its sub-millisecond precision, cleanroom design, and contamination detection capabilities:
- Sub-Millisecond Synchronization: The module’s 5ms signal response time enables nanoscale coordination of manufacturing equipment. Its 32-bit digital processing reduces overlay errors to <1nm, critical for 7nm/5nm chip patterns.
- Micro-Contamination Detection: Integrated particle sensor interfaces and high-resolution data conversion detect particles as small as 0.05μm. The module triggers automatic cleanroom purges and equipment shutdowns to prevent batch contamination.
- Cleanroom-Optimized Design: EMI-shielded, low-heat dissipation components (≤10W power consumption) meet Class 1 cleanroom standards. The module’s hermetically sealed housing prevents outgassing and particle emission.
- Advanced Process Control Integration: Compatibility with TSMC’s FabWorks™ process control system and ABB Ability™ Semiconductor Analytics enables real-time yield monitoring and process optimization. Predictive diagnostics alert to equipment drift before it affects yield.
Results: Higher Yield, Lower Costs, and Scalable Advanced Production
Seven months post-deployment, TSMC’s Hsinchu facility achieved breakthrough improvements:
- 32% Increase in Wafer Yield: 7nm wafer yield rose from 78% to 93%, adding €7.36 million in annual revenue from additional usable chips. The module’s precise synchronization reduced overlay errors to <0.8nm.
- 40% Lower Equipment Downtime: Contamination detection and predictive maintenance cut unplanned downtime by 40%, saving €920,000 annually. The module prevented 5 potential batch scrappings.
- 65% Reduction in Contamination Costs: Micro-particle detection eliminated 90% of particle-induced defects, slashing contamination-related costs from €680,000 to €238,000 annually.
- Cleanroom Compliance: The module’s low EMI and heat output eliminated the need for costly modifications, saving €450,000 in cleanroom upgrades. It operates seamlessly in TSMC’s ultra-pure manufacturing environment.
“The ABB XVC770BE101 has become a cornerstone of our advanced semiconductor production,” Dr. Chen said. “It’s not just a digital module—it’s a yield multiplier that enables us to meet the global demand for advanced chips.”
Lisa Wang, ABB’s Global Product Manager for Semiconductor Digital Solutions, emphasized the module’s industry leadership: “Semiconductor manufacturers need digital solutions that push the boundaries of precision and cleanliness. The XVC770BE101 series is engineered for the most advanced fabs, helping customers unlock next-generation chip production.”
TSMC plans to deploy the ABB XVC770BE101 across all its 7nm/5nm production lines in Taiwan and Arizona by 2027, aiming to achieve a global average wafer yield of 95% and reduce contamination-related losses by 70%.
